We are pleased to announce the launch of our IoTGO CAE Metal Press Forming Simulation Material Database service.

Kuno Metal Industry has released the IoTGO CAE Metal Press Forming Simulation Material Database Cloud Service. This service provides access to over 50 material data types specifically designed for forming simulations, allowing users to share data used by research institutions and participating companies. This enables simulations that consider material variations in mold design, allowing for anticipation of issues during test processing and mass production. The service also accommodates new materials, with the material data library continuing to expand.

In the background, forming simulations have become widely used in metal press processing. Various research institutions and companies have conducted tensile tests on forming materials to identify material parameters. However, these data have not been shared, resulting in an inefficient situation where each company conducts separate tests. The release of this service is expected to improve the accuracy and speed of forming simulations across the industry, while reducing mold costs.

Normally, material parameter data for CAE is sold for millions of yen. However, with this service, users can access the data list free of charge and purchase the data as needed. By subscribing monthly, the cost per data is reduced to less than one-fifth of the regular price, promoting the utilization of CAE.

This service was developed as part of a collaborative research project in Aichi Prefecture, involving Kuno Metal Industry, Nagoya Institute of Technology, Daido University, Nagoya Municipal Industrial Research Institute, Aichi Industrial Science and Technology Center, and four other companies. Through this collaborative development, it is expected to contribute to the improvement of accuracy in metal press forming simulations.

To apply, please review the cloud service terms of use and data usage agreement in the "Files" section below, and submit the application form via email or fax to the following address:

Company: MicroLink Co., Ltd.
Email: info@microlink.co.jp
TEL: 052-688-0521
FAX: 052-688-0567

For more detailed information, please refer to the brochure.